Abstract

Three carboxylic acids with varying chain lengths, succinic acid (SUA), adipic acid (ADA), and sebacic acid (SA), were used to modify nanosized boron nitride (BN) to enhance the mechanical properties and thermal conductivity of an epoxy/benzoxazine resin. Surface modification significantly reduced the viscosity of the epoxy/benzoxazine/BN adhesives, primarily due to improved compatibility between the resin and BN fillers. The adhesion strength to silver (Ag), copper (Cu), and gold (Au) lead frames increased at all tested temperatures following surface treatment. Thermal conductivity remained largely unaffected by the type of carboxylic acid, maintaing a consistent value in the range of 0.37–0.39 W/mK at 30 wt% BN loading.

Keywords: adhesives;benzoxazine;boron nitride;carboxylic acid;epoxy